Your choice of plated through-holes or filled vias
UltraSource offers two options for pass-through
conductance. First, we offer highly reliable plated
through-holes, with diameters as low as 50% of the
substrate thickness. These through-holes are laser
drilled, de-slagged and repetitively cleaned for optimum
metallization adhesion, and they are sputtered from each
substrate side for maximum step coverage and reliability.
When necessary, edge wrap around techniques, including
patterned edge wraps, can connect isolated front-to-back
conductors.
Annular borders around plated through-holes:
Plated through-hole sizes:
Substrate
Thickness |
Preferred Hole
Diameter |
Allowable Hole
Diameter |
| .005 |
ø.004" |
ø.003"–.005 |
| .010 |
ø.006" |
ø.006"–.010 |
| .015 |
ø.008" |
ø.008"–.015 |
| .020 |
ø.010" |
ø.010"–.020 |
| .025 |
ø.012" |
ø.012"–.025 |
Solid Filled Vias
To address issues that are sometimes associated with plated
through-hole technology, UltraSource also offers solid filled
vias. These vias eliminate epoxy and/or solder extrusion
during assembly process, provide a planar and low-resistance
microwave grounding path, and offer a high thermal
conductivity cooling path for high power die.
UltraSource offers three types of solid filled via circuits. They
are available on alumina (Al2O3), aluminum nitride (AlN) and
beryllium oxide (BeO) substrates and are post polished to
provide a high quality, planar surface.
- Solid gold (Au) filled vias
- Solid silver (Ag) filled vias
- Solid copper-tungsten (CuW) filled vias
Solid filled via design parameters:
| Substrate Thickness |
Filled Via Diameter |
Substrate Materials |
Center to Center Spacing |
| .005" |
ø.005" |
Al2O3, AlN, BeO |
.012" |
| .010" |
ø.008" |
Al2O3, AlN, BeO |
.025" |
| .015" |
ø.008" |
Al2O3, AlN, BeO |
.027" |
| .020" |
ø.010" |
Al2O3, AlN, BeO |
.029" |
| .025" |
ø.012" |
Al2O3, AlN, BeO |
.031" |
|
