 |

|
 |
 |
 |
 |
 |
SCD Requirements (Specification Control Drawing)
- Part size dimensions with tolerance, scale, units and smallest feature size clearly noted.
- Metal layers must include the following details by order. Thickness and tolerance must be listed:
| Resistor Layer |
50Ω/sq. TaN, TCR -100±50ppm/°C |
- Conductor Layer
- Tungsten-Titanium (WTi):
- Nickel (Ni):
- Gold (Au):
|
-
- 500Å ± 100
- 2,000Å ± 500
- 100µ" ± 25µ"
|
| Solder Layer |
4±1µm Pre-deposited 73/27 AuSn |
- Ground Plane
- Tungsten-Titanium (WTi)
- Gold (Au):
|
-
- 500Å ± 100
- 100µ" ± 25µ"
|
- Substrate thickness, tolerance and finish must be identified:
| Alumina, as-fired |
99.6% |
| Thickness |
0.025"±0.002" |
| Surface Finish |
<4µ" CLA |
| Camber |
0.001"/" |
- Specialty inspection requirements should be listed (i.e. bake testing, TCR).
- Customer name, customer part number and revision level must be listed on SCD.
- Resistance and/or capacitance charts should be provided:
| Resistor |
Nominal (Ω) |
TOL |
Length |
Width |
| R1, R4 |
18.8 |
+5/-20% |
.0150 |
.0400 |
| R2, R5 |
15 |
+5/-20% |
.0150 |
.0500 |
| R3, R6 |
12.5 |
+5/-20% |
.0150 |
.0600 |
| R7, R10 |
16.5 |
+5/-20% |
.0150 |
.0450 |
| R8, R11 |
25 |
+5/-20% |
.0150 |
.0300 |
| R9, R12 |
50 |
+5/-20% |
.0150 |
.0150 |
| R13, R16 |
50 |
+5/-20% |
.0450 |
.0450 |
| R14, R17 |
16.5 |
+5/-20% |
.0150 |
.0450 |
| R15, R18 |
11 |
+5/-20% |
.0100 |
.0450 |
| R19, R22 |
25 |
+5/-20% |
.0200 |
.0400 |
| R20, R21 |
12.5 |
+5/-20% |
.0100 |
.0400 |
- Additional layers thickness and tolerance must be called out (i.e. SiN, polyimide).
| Dielectric layer |
20,000Å ± 5,000Å Si3N4 |
- Additional layer properties must also be called out (i.e. 80/20 Au/Sn versus 70/30 Au/Sn).
| Solder layer |
4±1µm Pre-deposited over 73/27 AuSn |
- All pullbacks should be identified and dimensioned.
- Plating requirements must be defined.
- Front to back registration tolerance should be listed when applicable.
- Camber requirements should be listed.
- Filled vias must specify material Eg: Gold, Copper Tungsten, etc.
- Plated through-hole and via locations, diameters, and tolerances should be dimensioned.
|
|