Pre-Deposited Patterned Solder
AuSn pre-deposited solder eliminates the need for pre-forms and improves assembly efficiency and reliability. Additionally, this option can be configured for feature sizes as small as .002" square. Pre-deposited AuSn thickness range is from 3 to 10 µm.

Plated Through-Holes and Filled Vias
Solid filled vias are available in gold, silver, and tungsten. Plated through-holes have diameters as low as 50% of the substrate thickness. Edge wrap-around techniques, including patterned edge wraps, can connect isolated front-to-back conductors.

Photolithography and Etching of Patterns
UltraSource incorporates the use of both Mylar and glass photo masks for use in our photolithography processes. We can routinely achieve accurate patterning of feature sizes down to .001" (25.4 µm). On a custom basis, .0004" (10 µm) can be achieved. Standard patterning tolerances are ± .0002" (5 µm) with special tolerances from ± .0001" (2.5 µm) down to ± .00005" (1.25 µm).

Singulation
Singulation of thin film circuits from the substrates is achieved using the latest in high speed dicing saws and diamond based blades. This technology offers the most efficient means of singulating a broad range of substrate materials and metals. The standard tolerance is ± .001" (25.4 µm) and special tolerances of down to ± .0005" (12.7 µm) are available.

Multilayer Circuits
By combining our extensive knowledge of various substrates with our advanced UltraBridgeTM, UltraInductorTM, and UltraCapacitorTM technologies, we can offer you multilayer solutions to circuit challenges that you might never have thought possible.