Capabilities: Materials

Substrates

UltraSource is an expert at working with the following substrates:

• Alumina
• Quartz/Fused Silica
• Aluminum Nitride
• Beryllium Oxide
• Ferrite/Garnet
• Titanates
• Glass
• Sapphire
• Silicon

Resistor Films

Resistors are a logical extension to thin film circuit designs and are easily integrated with circuitry using Tantalum Nitride or NiChrome films that are available for many applications and ranges. A wide variety of sheet resistivities is available for all high-value, close-tolerance, and tight space requirements.

Polyimide

Polyimide is used for a variety of applications in thin film processing, such as: solder masking, encapsulation of resistors, encapsulation of fine line geometries, and as a dielectric for multi-layer structures. UltraSource can fabricate thin film designs with polyimide up to five layers in total. Of these layers, two are a dielectric layer using polyimide, and three are metal conductor/resistor layers.

Polyimide Options

Photo-Imageable

• 1 - 6 µm ± 20%
• Dielectric constant 3.0 - 3.5
• Smaller feature sizes - .001"

Etchable

• Patterned using positive photo-resist
• 5 - 25 µm ± 20%
• Dielectric constant 3.0 - 3.5
• Feature Sizes - .003"